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TenderMatch

Disco Hi-Tec Europe GmbH

Awarded by University College Cork · 04 Apr 2025

Contract value
€220000
Bids received
Procedure
Negotiated without prior call for competition
Notice ID
5505076

What was awarded

High Precision Wafer Grinding System for Tyndall National Institute (UCC)

Sourced from the public contract award notice (buyer reg. IE0006286E). Report an error to [email protected].